JPH0719144Y2 - 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置 - Google Patents

金属カッタを有する切断装置、およびその切断装置付き熱圧着装置

Info

Publication number
JPH0719144Y2
JPH0719144Y2 JP14046189U JP14046189U JPH0719144Y2 JP H0719144 Y2 JPH0719144 Y2 JP H0719144Y2 JP 14046189 U JP14046189 U JP 14046189U JP 14046189 U JP14046189 U JP 14046189U JP H0719144 Y2 JPH0719144 Y2 JP H0719144Y2
Authority
JP
Japan
Prior art keywords
tray
attached
cutting device
conductive film
anisotropic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP14046189U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0379428U (en]
Inventor
諭 鈴木
遵一 小出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP14046189U priority Critical patent/JPH0719144Y2/ja
Publication of JPH0379428U publication Critical patent/JPH0379428U/ja
Application granted granted Critical
Publication of JPH0719144Y2 publication Critical patent/JPH0719144Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP14046189U 1989-12-04 1989-12-04 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置 Expired - Lifetime JPH0719144Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14046189U JPH0719144Y2 (ja) 1989-12-04 1989-12-04 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14046189U JPH0719144Y2 (ja) 1989-12-04 1989-12-04 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置

Publications (2)

Publication Number Publication Date
JPH0379428U JPH0379428U (en]) 1991-08-13
JPH0719144Y2 true JPH0719144Y2 (ja) 1995-05-01

Family

ID=31687436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14046189U Expired - Lifetime JPH0719144Y2 (ja) 1989-12-04 1989-12-04 金属カッタを有する切断装置、およびその切断装置付き熱圧着装置

Country Status (1)

Country Link
JP (1) JPH0719144Y2 (en])

Also Published As

Publication number Publication date
JPH0379428U (en]) 1991-08-13

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